Reference-Plane Invariant Free Space Dielectric Material Characterization up to 330 GHz
- Salvador Moreno-Rodríguez,
- Mario Pérez-Escribano,
- Sergio Ortiz-Ruiz,
- Borja Plaza-Gallardo,
- Francisco G Ruiz,
- Carlos Molero,
- Carlos Molero,
- antonio alex amor
Salvador Moreno-Rodríguez
Department of Signal Theory, Research Centre for Information and Communication Technologies (CITIC-UGR), Telematics and Communications, University of Granada
Mario Pérez-Escribano
Telecommunication Research Institute (TELMA), Universidad de Málaga, E.T.S. Ingeniería de Telecomunicación
Sergio Ortiz-Ruiz
Department of Electronics and Computer Science, ) Pervasive Electronics Advanced Research Laboratory (PEARL), University of Granada
Borja Plaza-Gallardo
) Radiofrequency Area, National Institute for Aerospace Technology (INTA)
Francisco G Ruiz
Department of Electronics and Computer Science, ) Pervasive Electronics Advanced Research Laboratory (PEARL), University of Granada
Carlos Molero
Department of Signal Theory, Research Centre for Information and Communication Technologies (CITIC-UGR), Telematics and Communications, University of Granada
Corresponding Author:[email protected]
Author ProfileCarlos Molero
Department of Signal Theory, Research Centre for Information and Communication Technologies (CITIC-UGR), Telematics and Communications, University of Granada
antonio alex amor
Department of Electrical and Systems Engineering, University of Pennsylvania
Abstract
This paper describes the process followed to implement a system to characterize the complex permittivity of materials in the 10-330 GHz frequency band. Firstly, the method used and the system's calibration process are shown, consisting of a double calibration TRL (Thru-Reflect-Line) and GRL (Gated-Reflect-Line). Subsequently, a smoothing technique is used to improve the accuracy of the results. Finally, a test is performed on quartz and glass fiber samples, showing that the results are quite reliable over the entire measured bandwidth.24 Jan 2024Submitted to TechRxiv 26 Jan 2024Published in TechRxiv